March 2016
The Electronic Materials Report
New Service for Bulk Wet Chemicals, Advanced Formulated Cleans and Advanced Deposition Precursors for the Semiconductor Industry
Linx Consulting just finished its first edition of  The Global Process Chemical Service.  This report examines the leading bulk wet process chemicals used in the global semiconductor industry. The report covers supplier share by region for each key chemical covered including Sulfuric Acid, Hydrogen Peroxide, HF, Nitric Acid, HCl, Phosphoric Acid, Ammonium and IPA. The number and criticality of cleaning steps is increasing with each new technology node as illustrated below:

This phenomenon, along with the use of single wafer processing, multi- step patterning and less recycling, is driving demand for wet process chemicals used in cleaning and etch applications from approximately $1.3 Billion in 2014 to over $1.6 billion in 2019. 
Global Process Chemical Market 
Maximize revenue and identify opportunities with Global Process Chemical Service
Stay ahead of the market with The Global Process Chemical Service
For details and pricing, call 973-698-2331 or email us.
NOW AVAILABLE: Advanced Cleaning & Surface Preparation

Advanced Cleaning & Surface Preparation: Technologies and Markets, 2014-2019

Linx Consulting also just finished the 6th edition of Advanced Cleaning & Surface PreparationThis report covers leading applications for wet chemicals utilized in the global semiconductor industry including formulated cleans, solvent strips and critical SPM cleaning steps. It also provides analyses of leading suppliers and supplier shares of wet process chemicals and forecasts industry growth to 2019.

Cleaning Chemicals Market

In the sixth edition of Advanced Cleaning & Surface Preparation, Linx has uncovered several trends in cleaning and surface preparation:

Shrinking Device Features 
Shrinking device features will challenge cleaning technologies to deliver new capabilities and higher levels of particle removal with every generation. These shrinking geometries will challenge clean technologies to move beyond purely undercutting particulates to removal without loss of the underlying substrate.

Three-Dimensional Structures
3D Gate structures and stacked storage devices will constrain chemical and physical approaches to cleaning, requiring novel technologies to achieve defect free results. In addition, three-dimensional structures will have extreme aspect ratios, and very challenging mass transport requirements for the removal of contaminants from deep structures.

Sub 20 nm Particle Control
Sub 20 nm particle control for future semiconductor technologies will challenge both cleaning technologies and metrology in removal efficiency, and detection capability.

Novel Technologies
Application of novel technologies to 300 mm wafers, and the possibility of further wafer size increases early next decade will challenge equipment and process designers in terms of cost wafer uniformity of process results.

10 nm Cleaning Technology
Introduction of germanium PMOS has been delayed, but is regarded as a likely solution at 10 nm. However, the introduction of III-V NMOS technologies is likely to be pushed back even further, or be discontinued altogether, due to the difficulty of terminating stacking defects along the fin direction.

Learn more about Advanced Cleaning & Surface Preparation: Technologies and Markets

To attend the SPCC, the world's leading conference on semiconductor cleans, please visit 

INITIATING: Advanced Thin Film Advanced Thin Film Processes & Materials
Advanced Thin Film Processes & Materials for FEOL & Interconnect Applications, 2015 - 2019
The semiconductor industry has relied on CVD and PVD technologies to meet much of the requirements in thin film depositions. Along with these process technologies, many standard materials, such as SiO2, Al and Ti, have been relied on to meet a majority of the industry's needs. However, now the industry is facing significant change-starting with the conversion to FinFETS and VNAND, as well as high mobility channels, spacers, novel gates, and high-κ gate dielectrics, all growing rapidly.

These new devices are leading to the adoption of many advanced deposition precursors and processes including ALD, MOCVD, FCVD, Gapfill/SOD, electroplating and others.  This report examines the applications for advanced precursors and forecasts demand to 2020.
Advanced Deposition Precursors 

Learn more about Advanced Thin Film Processes & Materials for FEOL & Interconnect Applications, 2015 - 2019
Mike Corbett & Mark Thirsk
Linx Consulting
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