February 2015
The Electronic Materials Report

Integrated Circuit Packaging Report Now Available

New Report on IC Packaging Now Available

Linx Consulting is working with IC Knowledge, the world leader in cost modeling of semiconductors and MEMS, to distribute a new report entitled Integrated Circuit Packaging.  Integrated Circuit Packaging is a top down, high level study of the semiconductor industry. The report provides an overview of the total IC packaging market as well as related technologies.


Integrated Circuit Packaging covers all IC Packaging technologies, including the latest TSV, 2.5D and 3D technologies.  The report is 84 pages long, includes 55 full color figures and 40 data tables.



  • Chapter 1 - Welcome
  • Chapter 2 - The Packaging Market and History
  • Chapter 3 - Package Types
  • Chapter 4 - Packaging Process Overview
  • Chapter 5 - Wafer Level and Multi Chip Packages
  • Chapter 6 - Green Packages
  • Chapter 7 - Packaging Materials
  • Chapter 8 - Packaging Cost
  • Chapter 9 - Test
  • Chapter 10 - Qualification
  • Chapter 11 - Selecting and Managing Packaging Foundries
  • Chapter 12 - Profiles of the Top 10 OSATs


Integrated Circuit Packaging is available to the single user for only $1,000 (USD) and $3,400 (USD) for corporate-wide access.


If you need any additional information, please feel free to contact me at 570-595-6493 or Mark Thirsk at 617-273-8837.


We look forward to hearing from you!




Audrey Parton


Mike Corbett & Mark Thirsk
Linx Consulting
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