June 2014
The Electronic Materials Report  
Linx at SEMICON West TechXPOT Materials Session
SEMICON West Econometric Semiconductor Forecasting Workshop
CGMG Materials TechXPOT: The Future of NAND Flash
Linx at SEMICON West TechXPOT Materials Session

In comparison to planar NAND, 3D NAND will offer higher endurance, faster write speed and lower power consumption while relaxing lithography requirements. The CGMG Materials TechXPOT, Speeding on the Roadmap-The Future of 3D NAND Flash is a two hour forum that will:

  • Investigate the markets for new devices; 
  • review new device structures; 
  • shed light on critical thin film technologies, including clean, etch & deposition; 
  • discuss the implications for materials suppliers, and
  • allow participants to ask questions of industry leaders.
As the premier electronic materials consultants to the semiconductor industry, Linx will be moderating as well as presenting at this years session.

TechXPOT Materials Session Details

Speeding on the Roadmap-The Future of 3D NAND Flash 

Date: Tuesday July 8 

Time: 1:30 - 3:30

Location: TechXPOT North Stage, North Hall, Moscone Center


Introduction to the Session "Speeding on the Roadmap - The Future of VNAND"

Mike Corbett - Managing Partner, Linx Consulting


Materials Market Perspective

Mark Thirsk - Managing Partner, Linx Consulting


To schedule a meeting with Linx Consulting at SEMICON West call Mike Corbett at 617-273-8837 or email him.
SEMICON West Econometric Semiconductor Forecasting Workshop

What's in store for the 2nd half of 2014?


Linx Consulting and Hilltop Economics are partnering to create a special event for semiconductor materials suppliers at this year's SEMICON West. Join us for an interactive workshop to review the Econometric Semiconductor Forecast to date and lay out some scenarios for the remainder of 2014.  


The workshop will include a question and answer session where participants can gain valuable insight from the industry's most accurate monthly forecast. The workshop is free to those who qualify, but space is limited, so please register ASAP.


Econometric Semiconductor Forecasting Workshop

Workshop Leaders
Mark Thirsk - Linx-Consulting

Mike Corbett - Linx-Consulting

Duncan Meldrum - Hilltop Economics


Join us at SEMICON West

Tuesday July 8 at 4:30 PM PST


Register now for the Econometric Semiconductor Forecasting Workshop

Space is limited, so register early!

Linx Reports: Advanced Thin Films, TSV 
Advanced Thin Films Research Begins

Linx Consulting has begun research on the 5th edition of our highly detailed study analyzing the global markets for advanced precursors used in semiconductor device fabrication - Advanced Thin Film Processes & Materials for FEOL and Interconnect Applications, 2014-2018.

The 2014 edition of Advanced Thin Film Processes & Materials for FEOL and Interconnect Applications is a report of approximately 400 pages, with the latest perspectives on technology, market opportunities, and future technology needs. The report includes:
  • Detailed Forecasts by product and application to 2018
  • Market shares of the largest suppliers for 2013
  • Detailed overview of the application technology
  • Report published in PowerPoint with all data embedded
  • Company-wide license
  • Consulting time to answer specific questions
Deposition Technologies Covered: Atomic Layer Deposition, Chemical Vapor Deposition, Physical Vapor Deposition, Spin-on Dielectrics and Electro Chemical Deposition

Applications Covered: Metal Gates, High-k Gate Dielectrics, High Mobility Channels, Strain & Spacers, STI/PMD, FinFETs, High-k Capacitors, NAND FEOL Structures, NAND 3D Structures, DRAM FEOL Structures, Interconnect Materials.

In addition, we are segmenting the report by Physical Deposition (PVD, SOD and ECD) and Vapor Deposition (ALD and CVD), making it easier to acquire only the needed sections.  Key insights from Edition IV are shown below:
Save 20% - Pre-order Advanced Thin Film Processes & Materials 

The report is scheduled for release later this year, but if you pre-order, you can take advantage of a 20% discount. The deadline for pre-ordering is July 11, 2014, so order this valuable report now to save. Purchase the entire report, or just the vapor deposition or physical deposition versions for a reduced price.

As a charter subscriber, you'll get these benefits:
  • 20% discount
  • Input into report scope
  • Global corporate license
  • Electronic copy of report and all data tables
  • One day consulting time with purchase of the full report and half day of time with the partial purchase of one section.
Linx CMP Series now complete with CMP- TSV and Thinning

Linx Consulting is pleased to announce that we have published EMERGING APPLICATIONS IN CMP-TSV AND WAFER THINNING, 2014. TSV technology is being positioned to assist in delivering performance-based benefits for semiconductor devices in advanced logic and memory devices. CMP processing will be critical in manufacturing TSV based devices and interposers. This new report allows companies to understand the impact of the change and plan for it. 


Emerging Applications in CMP-TSV and Thinning 2014 is the last of three reports on CMP: 

For more information or to order Emerging Applications in CMP-TSV and Thinning 2014, call us at 973-698-2331.

Mike Corbett & Mark Thirsk
Linx Consulting
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