NOW AVAILABLE - Advanced Thin Film Processes & Materials for FEOL and Interconnect Applications, 2012-2017
- Logic devices converting to FinFETS, and eventually FinFETs with high mobility channels
- Rapid growth in novel metals gates and high-κ gate dielectrics
- Rapid growth in spacers used in lithography for pitch doubling applications
- Next generation barrier and seed materials
High-K dielectrics and 3D structures in NAND
The growth of novel thin film precursors used in these emerging applications, segmented by deposition technology, is illustrated below:
Thin Film Deposition Growth ($Basis)
Advanced Thin Film Processes & Materials for FEOL and Interconnect Applications, 2012-2017 predicts the market for advanced precursors will reach to $3B by 2017. This growth in advanced precursors is driven by the challenge to continue scaling and represents significant opportunity for chemicals and materials suppliers, OEMS, and other technology developers.
INITIATING: CMP Consumables & Specialty Abrasives Service
The service consists of three reports:
- Report I - CMP Markets and Technologies for the 11/10nm Node
In this report, we survey the CMP material growth for slurries and pads in wafer fab processing. We review applications (by device process module and technology node) and suppliers, and conclude with an analysis of business opportunities.
- Report II - Specialty Abrasives for CMP
This report analyzes emerging CMP processes and materials with emphasis on the trends for abrasives. Additionally, we forecast abrasive demand using the Linx Materials Models, assess key suppliers, and analyze potential business opportunities.
- Report III - Emerging Applications in CMP: TSV and Wafer Thinning TSV offers the potential to reduce device footprint and increase functionality. In this report, we present the key drivers for TSV and survey the different approaches to the technology. The relevant CMP consumables for front side and backside applications and major market participants, as well as potential business opportunities are described.
The report will be published in the 4th quarter 2013 with Report 1 scheduled for October, Report II in November, and Report III in December.