As 2012 comes to a close, Linx would like to thank you for your continued support, and wish you and your family a happy and healthy holiday.

Linx had a busy year, completing and initiating several semiconductor industry reports:

• Cleaning & Surface Preparation: Technologies and Markets, 2011-2016  
• Advanced Thin Film Processes & Materials for FEOL & Interconnect Applications, 2010-2015 
• Emerging Materials for TSV Devices 
• CMP: Wafer Polishing
• Analysis of the Global Metal Organic Deposition Precursor Market 

In 2013, Linx will be initiating the following projects: 

• Econometric Semiconductor Industry Forecasting 
• CMP Technologies and Markets: Slurries and Pads
• CMP: Specialty Abrasives 
• Roadmaps on New Device Architectures in Memory and Logic as well as Related Materials Needs
• TSV Part II: Emerging Technologies and Advanced Materials