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November 2012
The Electronic Materials Report  
Linx Initiates two new studies on Metal Organic Precursors and Advanced Thin Films
INITIATING:Analysis of the Global Metal Organic Deposition Precursor Market
Linx is initiating the first edition of a new report entitled:

Analysis of the Global Metal Organic Deposition Precursor Market
 
CVD, epitaxial, and ALD deposition of thin films on electronic devices is becoming a critical method of depositing the critical, functional materials needed in high performance devices such as:
  • Advanmetal organic depositionced ICs
  • HBLEDs
  • Compound semiconductors 
  • Flat panel displays
  • MEMS 
This report will analyze the supply chains for the basic materials, intermediates, and most important molecules used in deposition processing, including TMA, TMI, TMG, TEG and dopants as well as detailing the key players, and their respective market shares. 
 
For more information or to order Analysis of the Global Metal Organic Deposition Precursor Market call Mike Corbett at 973-698-2331 or email us.
INITIATING: Advanced Thin Film Processes & Materials for FEOL & Interconnect Applications, 2012 - 2016

Linx is pleased to announce initiation of the 4th edition of our highly respected report on Advanced Thin Film Processes & Materials for FEOL & Interconnect Applications.

gate transistor  

The semiconductor industry has relied on CVD and PVD technologies to meet much of the requirements in thin film depositions. Along with these process technologies, many standard materials, such as SiO2, Al and Ti, have been relied on to meet a majority of the industry's needs. However, now the industry is facing change with DRAM using ALD at 90 nm and converting to copper en masse at 45 nm, as well as low-κ materials, novel gates, and high-κ gate dielectrics all growing rapidly. 

 

For more information about Advanced Thin Film Processes & Materials for FEOL & Interconnect Applications, 2012 - 2016, call Mike Corbett at 978-698-2331 or email us.

Strategic Materials Conference Presentation
Mark Thirsk presented once again at this year's Strategic Materials Conference.  The theme of this year's conference was Entering an Age of New Materials and Markets.

Mark discussed materials trends for the industry in his speech entitled, Opportunities and Challenges in Materials for the Semiconductor Industry.

Detailed below is an example wafer BOM cost for an ASIC device, built on a 300mm wafer at different technology nodes:

 

Asic 300mm graph

 

The presentation outlines opportunities in semiconductor materials including:

  • Evolution of semiconductor industry materials market through 2018
  • Introduction of 450mm wafers 
  • Logic Development
  • Implementation of 3-D memory
To receive a free copy of this presentation, please contact Mike Corbett at 973-698-2331 or email him.
Semiconductor Industry Trends and Opportunities

Linx presented at the Ultrapure Water - Micro 2012 in Phoenix on November 13.

 

The presentation, entitled Semiconductor Trends and Opportunities includes:

  • Long Range Device Mix Forecast
  • Logic Device Roadmap
  • 300mm and 450mm Fab Water Requirements
millions of gallons per year, per fab

For a free copy of Semiconductor Trends and Opportunities
, call Mike Corbett at 973-698-2331 or email us.
Mike Corbett & Mark Thirsk
Linx Consulting
www.linx-consulting.com
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