Reviewing 2014 New Year's Resolutions |
Lynn Reed |
Now that it is December, it is time to review my New Year's resolutions for 2014. I made 10 of them, and here they are.
* We will bring out programmers for our user programmable versions of our 68XX 80C51, and 28F010 families.
Done. We have introduced the programmer for the 68HC711D3. While the other programmers are in progress, this has turned out to be a difficult task.
* We will develop new high temperature standard products.
Done. We have three high temperature products in design. These are an 8051 processor, a 1553 bus driver, and an EEPROM with refresh and error detection and correction logic.
* We will also work on improving NVM performance at 175C.
Done. We have shown that a refresh cycle is a valid method of improving memory retention at high temperature. The results of this work were published at the Hi-Tec Conference last May.
* We will bring out 0.18 micron ASICs
We missed this one. The growth in the high temperature area consumed the resources that we would have gone into 0.18u.
* We will expand our Japanese sales.
Done. Our Japanese sales were up, and we continue to push forward in this area.
* We will expand our use of adapters as an alternative for obsolete packages.
Done. We have sold three products this year on adapter cards. One was an ASIC that needed an adapter to replace a 256-pin PQFP package. One was our
68020 microprocessor that used an adapter to emulate a 132-pin BQFP package, and one was an adapter for our
80C186EC processor to emulate the 100-pin BQFP package.
* We will add a wafer probe capability.
In progress. We have the probe machines, and are working to bring them on line.
* We will expand our high temperature (+175C) test capability.
Done. We were using a temperature forcing probe to test parts. This required about 5 minutes per part, and was a serious capacity limitation. Now we have test boards that allow us to test about 50 parts per hour, and we can easily increase that amount as needed.
* We will complete the product qualification studies on our new 0.35u technology.
Almost done. We have completed all tests except life test, and that is under way.
* We will perform multiple high temperature reliability studies at 175C.
Done. We have collected a good deal of data at 175C, 190C and 210C. One thing that we have learned is that while the parts behave well, the test hardware deteriorates rapidly, and frequently fails beyond 2500 hours.
Overall, I think that we have done pretty well. And definitely better than the resolutions I made for myself.