Tekmos Talks
A Newsletter for the Semiconductor Industry 
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April 2014
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From the Desk of the President
High Temp Testing
Tekmos News
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Applications for Tekmos Products:
  • Automotive
  • Industrial
  • Military
  • Medical
  • Telecommunications  
The following are standard generic microcontroller devices available from Tekmos.
If you need a similar product not listed, contact Tekmos:  

 

Intel replacements by Tekmos 

TK80C51

TK80C188EB 

TK80C186EB 

TK80C186EC - samples soon! 

TK80C188EC - samples soon!

 

NXP replacements by Tekmos

TK87C751

TK83C751

TK89C668

 

Freescale replacements by Tekmos

TK68HC11A1

TK68HC11D0

TK68HC11E1

TK68HC11K1

TK68HC711B16 and B32

TK68HC711D3

TK68HC711E9

TK68HC711E20

TK68HC05 series

TK68HC705B series

TK68HC811E2 - samples soon!

TK68020 - samples soon!

 

Intel, NXP and Freescale are registered trademarks by these respective companies.
   


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Welcome to Tekmos Talks April. This month we will share about "Bringing up a New Fab", "High Temperature Testing", and upcoming news and product development for Tekmos.

Tekmos High Temperature ASIC and High Temperature Micros 175/250C for Extreme Environments...hot chips!
From the Desk of the President
LReed
Lynn Reed, President
Bringing Up A New Fab

Over the past nine months, Tekmos has been qualifying a new fab for our 0.35u production.  There are a lot of steps involved with that that I will review here.

 

Fortunately, there are a lot of similarities in the available 0.35u process.  A well designed part that works in one process will likely work the same way when manufactured in another fabs 0.35u process.  The challenge is in the conversion from one process to another.

 

The conversion starts with the layout rules.  The rules from both fabs must be compared and differences identified.  In our case, the rules had one major difference:  the gate length for 5 volt transistors increased from 0.5u to 0.6u.  An increase in length of 500 atoms may not seem like a lot, but it caused a lot of problems.  In a gate array architecture, the key design parameter is the routing grid that is used for interconnect.  There are many variables that influence the grid, but one of the main ones is the center to center spacing of two contacts with a gate between them.  When this changed, the entire routing grid changed, and that meant that we could not reuse our existing layouts.

 

Instead, we had to create a new technology based on the new process.   As with all new technologies, we study the layout rules, and create DRC checks to verify that our new layouts are compliant with those rules.  We check our work by creating a structure that contains each layout rule with a good and bad case.  Then we run our DRC checks on that structure to validate the checks themselves.

 

Next we create the "block" that contains the transistors that we use to build everything else.  A block typically consists of three pairs of transistors.  Why three?  This is a tradeoff between efficiency in building a logic gate, and the waste if a given gate doesn't use all of the resources.  As with most things in life, the optimum is "e", or 2.71.  Since we must use whole transistors, we have a choice between 2 and 3 pairs.  We chose 3 pairs.  Most companies use 3 pairs.  Some use 2 pairs, and a few use 4 pairs.  

 

Once we have a block, we build up our library of logic gates.  For the most part, our library is unchanged between the different technologies that we use, and this time was no exception.  Using a common library prevents mistakes in creating new technologies, and makes it easier for designers to use the libraries.  The new library is subjected to LVS and DRC checks before it is added to the place and route library.

 

We also use the block to build up gate arrays.  In our new 0.35u process, we have created gate arrays with 127K gates (176 pads) and 270K gates (256 pads).  We will create at least two more, smaller gate array sizes in this technology.    Read more... 

 

 For more information on inventory sales or orders, please contact Bob Abrams, Vice President of Sales & Development or call 512-342-9871512-342-9871

High Temperature Testing
tekmos chip blue flame  

     

 

  

    

 

 

 

  High Temperature Testing

  One issue in selling high temperature circuits is proving that they work at high temperature.  And that means testing at high temperature.  One of our products is rated at 175C.

 

The basic handlers go to 150C.  And while it would be possible to boost the temperature to 175 by modifying the controller in the handler, that could cause many other problems, such as damaging part of the handler, or even starting a fire.

 

 One could create an extender cable, and put a socket in an oven.   That works, but there is a cycle time associated with ovens, and the throughput would be measured in parts per hour.  We would also like to minimize the time that a test operator has to work in front of an open oven door.

 

Our approach is to create a board with multiple sockets on it.  This shares the cycle time over many parts, and so our throughput goes up into the 100 part / hour range.

 

Having multiple parts on a board introduces test problems.  A part has 48 wires associated with it.  50 parts has 2400 wires.  This is a huge bundle, and the logistics of dealing with it are overwhelming.  So we have to develop a better solution.

 

All of our parts are microcontrollers.  As such, they can communicate serially.  If we give each controller a different address, then we can connect all microcontrollers with a total of 6 wires:  2 supplies, reset, clock, transmit and receive.  

 

With the wire problem solved we now have one last problem: how to actually test the processors.  Each processor has a bootstrap mode that allows a program to be downloaded externally.  We can use this program to exercise, and thus test, each portion of the processor.  It takes a while, but since the processors can be running in parallel, the overall throughput is not affected.

 

And that is how we hot test parts.

 

For Tekmos product information contact Bob Abrams,  
Vice President of Sales & Business Development at 512-342-9871512-342-9871 
     
     

 

Tekmos News & Product Development

 

 

 

  

     

 For more information on product sales or manufacturing, contact Bob Abrams, Vice President of Sales and Business Development in our main office at 512-342-9871512-342-9871


 



Thank you for reading Tekmos Talks. Contact  Bob Abrams, Vice President of Sales & Business Development, call (512) 342-9871 or email Sales for more information on our most recent "tape outs", our high temperature ASIC, or our other quality products.

We appreciate our customers. Tekmos is meeting innovation every day for tomorrow's challenges.

 

Sincerely,

 

Lynn Reed, President
 
4120 Commercial Center Drive, Suite 400
Austin, TX 78744
Phone: (512) 342-9871
Fax: (512) 342-9873