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Tekmos Talks
A Newsletter for the Semiconductor Industry

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May  2013
In This Issue
From the Desk of the President
Tekmos New Packaging
Tekmos News Highlights
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Applications for Tekmos Products:
  • Automotive
  • Industrial
  • Military
  • Medical
  • Telecommunications 
    

Greetings!
Tekmos packaging

Welcome to Tekmos Talks May. This month's newsletter will talk about FPGA Conversions and will share Tekmos' "news highlights" of company activities including the launch of new Tekmos products.

 
Tekmos High Temperature ASIC and High Temperature Micros 175/250C are still the hottest in the world!

From the Desk of the President
LReed
Lynn Reed, President

FPGA Conversions  

 

An FPGA conversion consists of creating an ASIC from the same design files that were used to make an FPGA.  Customers do this to either replace an FPGA that has been discontinued, or as a cost reduction for a product that has increased in volume.  The main tradeoff in an FPGA conversion is the expense of the NRE against a lower unit cost.  This number breaks even with a volume of about 1000 units.  For obsolete FPGAs, the cost of the NRE has to be contrasted against the other options of a system redesign or the availability of parts on the gray market.

Tekmos asks several questions before doing an FPGA conversion.  How big is the design?  How fast is it?  How much RAM does it contain?  How many pins does the design use? What type of package is required?  Does it contain someone else's IP?  Are there simulations? There are reasons behind these questions.

 

How big is the design? 

This question may also be phrased as "What is the utilization?"  Both questions yield the design size.  The design size determines the size of the ASIC necessary to implement it, and that determines the cost.  The size also roughly corresponds with the amount of engineering work that we will have to do during the conversion.  And that has an impact on the NRE charges.

 

 

How fast is it? 

This is our way of determining the process technology that I will need to implement the ASIC in.  FPGAs have been technology drivers, and are always pushing the wafer fabrication limits.  Fortunately, an ASIC can be 2 to 3 generations behind an FPGA, and still provide the same performance.  This is because a gate is inherently faster than the CLBs used inside of the FPGA for logic functions.  Also, many customers do not use the FPGA anywhere near its speed capability.  If we can use an older technology, we may substantially reduce both the NRE and unit price.

 

How much RAM does it contain?
 

How many pins does the design use?

 

What type of packages are required?

 

Does the design contain someone else's IP? 
 

Are there simulations? 

 

Implementation  
               to learn the answers to these questions.  

 

 
Tekmos Talks New Packaging
To better improve Tekmos Quality Control we have implemented a re-design of how Tekmos parts are shipped around the world.
  • We have a new method of strapping trays together.
  • The new inner boxes are designed to exactly fit our trays.
  • New outer boxes that are easily identifiable with the Tekmos logo, fit our inner boxes exactly. 

We can ship your design efficiently anywhere in the world you require. Tekmos is always looking for ways to improve customer satisfaction.
Tekmos News Highlights
Tekmos alternative packaging
Tekmos News:

We reached our highest volume order in Tekmos history for the 100,000 piece single order for TK68HC05J1A
microcontroller, making May a busy month.

Lynn Reed's paper on High Temperature ASIC's
has been accepted for presentation at the High Temperature Electronics Network (HiTEN) July 8-10, 2013 at St. Catherine's College Oxford in Oxford, United Kingdom.

Tekmos Product Development:

 

We have taped out the new product TK68HC11EA and are making prototypes

 

We are sampling 2 new parts:  TK68HC711E9 and TK68HC711E20  

 
We are also proud to announce tape out on our largest ASIC yet, using a gate array with 1/2 million gates. 

 

Tekmos new products.  These are user programmable versions of previous parts. We have production quantities available.

 

TK68HC705B16

TK68HC705B32

TK68HC711D3

 

For more information on our products contact our Vice President of Sales & Business Development, Bob Abrams , find a Distributor or call (512) 342-9871.  

 

  To learn further about ...
Thank you for reading Tekmos Talks. Contact  Bob Abrams, Vice President of Sales & Business Development, call (512) 342-9871 or email Sales for more information on our most recent "tape outs", our high temperature ASIC, or our other quality products.

We appreciate our customers. Tekmos is looking back while innovating for tomorrow.

 

Sincerely,

 

Lynn Reed, President
Tekmos
4120 Commercial Center Drive, Suite 400
Austin, TX 78744
Phone: (512) 342-9871
Fax: (512) 342-9873
Email:  Sales@Tekmos.com
For a List of Sales Reps or Distributors