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Insuring Top Quality on WLCSP Products
Today, more products are being delivered as bare die
or WLCSP (Wafer Level Chip Scale Package.) This is especially true in space-sensitive mobile applications, stacked products and automotive & industrial sensors.
Manufacturers are well aware of the special risks associated with shipping such products and need new tools to protect their quality reputations.
Salland's announcement of Skeleton generated very positive reactions from chip manufacturers worldwide.
In this announcement, you will learn...
- Why WLCSP & bare-die products are susceptible to special quality problems not found with packaged parts?
- Why customer exposure to any quality issues is higher than with packaged parts?
- Why current tools for reducing these risks are totally inadequate?
- Why a robust, commercially supported solution like Skeleton is a clear winner!
Read more on how it works and how it can be seamlessly integrated into your test operations.Click here for Skeleton
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