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The chemistry behind solder mask developing.
Last month I shared the background in the chemistry of how a solder mask is exposed. This time I would like to share the background on the developing process. Clearing out solder mask from small holes and tight areas is a great concern from many during manufacturing and assembly. The chemistry behind the developing process is quite simple. Below is the chemical reaction:
What is occurring is that the developer solution, sodium carbonate (Na2CO3), reacts with the carboxyl group (COOH) on the unexposed solder mask to form a salt (COO- Na+) with the unexposed solder mask. This salt then becomes an emulsion and dissolves into the developer solution.
Although the chemistry behind the developing process is simple, the more important part of the process is maintaining a good developing solution, clean nozzles and good rinsing. The solution needs to be maintained between 1.0% - 1.3% Sodium or Potassium Carbonate with as little defoamer as possible (a feed and bleed is highly recommended). If you do choose to run a feed and bleed, it will be necessary to do a chemical clean at least once per month and a solution change at least once per week. The temperature of your developer should be maintained between 85 - 95�F (29 -35�C) with a minimum pH of 10.8. Fan nozzles are highly recommended as they will provide better developing for through holes. A good clean surface and through holes will make for fewer problems as you proceed to final finishes and assembly.
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On the Edge...of Solar Panels
In the world of solar energy, the design of the solar panel is just as important as the solar cell itself. Regardless of the technology used in the solar cell, be it crystalline or amorphous silicon, CIGS, CdTe, etc., there is a drive in the industry to design better solar panels to more efficiently collect the energy that the cells generate. Research institutes such as Fraunhofer ISE (http://www.ise.fraunhofer.de/en) and NREL (http://www.nrel.gov/) are investigating various changes in design and materials in order to produce longer lasting more efficient solar panels.
One of the newer solar panel designs is called MWT, or Metal Wrap Through. Taiyo has been involved in testing our products for this solar panel configuration which is now being employed by a number of solar manufacturers. The diagram below shows the design of the MWT solar cell and the products that Taiyo is incorporating into this device.
By working with manufacturers and research institutes alike, Taiyo is able to stay in the forefront of technology and continue to be Your Ultimate Solution.
Sincerely,
Josh Goldberg
Marketing Specialist
For readers that are interested in information regarding these exciting technologies, the materials, processes, or our participation, please feel free to contact me at [email protected] or at 775.885.9959, x. 132.
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FlexTech Alliance Conference
Josh Goldberg, Taiyo's Marketing Specialist, attended the FlexTech Alliance Conference held in Phoenix, AZ on January 29 - 31. The conference offered short courses in various Printed Electronic related subjects including OLED barrier coats, Flexible photovoltaic cells, and roll-to-roll electronics manufacturing. There were also a number of Printed Electronics workshops, and a tour on offer at the ASU (Arizona State University) Flexible Display Center. The exhibition featured over 100 booths, a research poster section from various university research groups from around the country and almost 100 presentations from world-wide companies developing Printed Electronics materials, devices, and manufacturing processes. Taiyo has products that fit into the Printed Electronics Industry now and is currently working on many more for the future! |
ALSO SEE US AT...
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PRESS RELEASE: Taiyo America
For immediate release
For more information contact: Melanie Binzel
ITC Intercircuit GmbH of Munich, Germany has reached an agreement with Taiyo America to have its PCB equipment represented by Taiyo America in both North and South America.
About ITC Intercircuit GmbH
Founded in 1972 as an independent distributing organization, ITC Intercircuit GmbH has expanded to a world class manufacturer of PCB equipment. Our service center in Burkhardtsdorf, Germany is Europe's only service center for via fill applications where we use our own designed and built equipment. The company has recently completed sales in Japan, Russia and India, both a 1st for via fill equipment manufacturers. Owner and president of ITC Intercircuit, Mr. Erwin Haertl feels very confident that this new partnership with Taiyo America will compliment both companies extremely well. PCB companies will be able to receive the highest quality solder masks and via fill pastes and the industry's most advanced delivery systems through one source - Taiyo America.
For more information, please visit us at: www.itc-intercircuit.de
About Taiyo America, Inc.
Taiyo America, Inc., a manufacturing subsidiary of Taiyo Holdings Co., Ltd. (Japan), is the largest supplier of solder mask and via fill material in North and South America and has been meeting the industry's needs since 1990. Taiyo's world-class technology in tandem with our global support network has propelled us to the position of world leader in solder mask products. In partnering with ITC, Taiyo America can provide the ultimate solution for via filling.
For more information, visit us at: www.taiyo-america.com
Melanie Wylie Binzel
[email protected]
775.885.9959, ext. 139 |
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Taiyo America, Inc. is a subsidiary of TAIYO HOLDINGS CO., LTD., the world's leading manufacturer of specialty inks and solder masks for printed circuit boards. Based on Taiyo's own proprietary technology, Taiyo's PSR-4000 liquid photoimageable solder mask products have been patented throughout the world. Taiyo now offers conductive inks for manufacturing printed electronics, solar cells and other applications. |
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TAIYO AMERICA, INC.
2675 Antler Drive
Carson City, NV 89701-1451
Ph:(775) 885-9959
Fax:(775) 885-9972
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