Interview with Toru Fukata, Manager of Overseas Sales
Every month we like to visit with one of the key team members at Taiyo and see what they are up to. I ask them six key questions (hence the name Dan's Six Pack); this month I am talking to Toru Fukata who is the Manager of Overseas Sales for Taiyo Ink in Japan.
DAN: Hello Fukata-san, thank you for taking the time to speak with me today. Tell me please how do you see the packaging market today? Is it very strong?
Fukata-san: Hello Dan-san. The total packaging market has been stable the past 2 years, but we see a portion for liquid type solder mask has gradually decreased and been replaced by dry film type solder mask, especially for FC-CSP products used for smart phone application. This is because this application requires co-planarity of solder mask.
DAN: You have been working with Taiyo Ink since 2006 and traveling all over the world. What do feel is the biggest challenge today facing your customers when it comes to solder mask?
Fukata-san: An example would be solder mask for packaging applications, OEM (e.g. Qualcomm, INTEL, nVidia) approval of solder mask, and substrate manufacturers basically needing to listen to the needs of the OEM. This is also the same for automotive applications and general HDI products. However, substrate/HDI manufacturers sometimes feel uncomfortable if we promote products straight to the OEM. Strengthening relationships with OEMs to gain the business is very important, but we also have to take care of our substrate/PCB manufacturers.
DAN: In terms of Taiyo's newest products, what do you think is the best and most useful product they have created in the past year, and why?
Fukata-san: We have been promoting PFR-800AUS SR1 since 2008 and recently succeeded to gain the business for the LTE chip. This product will be used by Apple, Samsung, HTC, etc. for almost all major smart phones for this year. At the JPCA show 2012, PSR-4000 HT1 was the most popular product according to our questionnaire to visitors. This product is a high heat resistance type which withstands 150°C for 1000 hours.Thermal shock resistance, thermal decomposition temperature, and insulation resistance are very much improved compared to our conventional solder mask.
DAN: What are your thoughts on the global market going forward? What parts of the world are growing the fastest? Which technologies are growing the most?
Fukata-san: We may be able to say that currently the global market is led by smart phones only. Many of our customers are very interested in getting this business. The China market should still grow although there are some concerns; infrastructure at post-China countries in Asia such as India and Vietnam is still not well prepared and the presence of Thailand is high for automotive industries.
DAN: Can you tell me a little bit about additional new and exciting Taiyo products that are being developed at this time?
Fukata-san: For packaging applications, we are developing a new product to be released in 2016. As the UV-based direct imaging exposure unit becomes popular in Japan/Asia recently, all of our new products for packaging and HDI shall be compatible with UV-DI units.
DAN: Okay, we have time for one last question. Can you talk about the differences between the North American & European markets versus the Asian Market? Our readers are always interested in this.
Fukata-san: There are big differences is market size. Estimated consumption for solder mask in Asia is more than 30 times of N.America/Europe, and China accounts for around 70% of the worldwide market.
DAN: Fukata-san, thank you so much for taking the time to talk with me today. It is aways refreshing to get a new perspective on the products and the market. Your candor and openness have made for an interesting discussion. Good luck in your endeavors this year.
To contact Mr. Fukata email him at fukata300@taiyoink.co.jp.
