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In this Issue


Whitepaper:  Potting Compound Selection for Power Supplies. 



Whitepaper: Case Temperature vs. Ambient Temperature.


Whitepaper:  What to expect from your LED driver in the future.


Presentation: Light Emitting Diodes: What you need to know about driving High Brightness LED's.



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All at Excelsys would like to wish you a Happy and Prosperous New Year. To kick off the year, we are delighted to send you the first of our LED newsletters of 2013.

The theme of our LED Customer newsletter is Reliability. We have produced 3 whitepapers in order to explore and demonstrate PSU reliability in the LED market. Our first paper is written by Triona Dolan, a member of our expert engineering team; it looks at the factors which influence the selection of particular potting compounds


We feature two additional papers created by our Applications Engineering team. One paper looks at two base temperature measurements, Case Temperature and Ambient Temperature. The 3rd paper discusses the challenges facing a design team as they go through the specification and design stages of a power supply that will be used to drive High Brightness LED's.  


In this newsletter we also have a presentation written by Shane Callanan, Director of Applications Engineering. Shane presented this paper as part of the Winter Series Lectures for Engineers Ireland. The key focus of this presentation is on maximising the performance of High Brightness LED's.


Your feedback on our newsletter is always welcome. Please feel free to contact us with your comments, opinions and suggestions for specific future feature topics.   
Grace Mulqueen
Marketing Executive
Excelsys Technologies Ltd

Potting Compound Selection for Power Supplies


There are several different types of potting compounds on the market which are designed to perform different functions. Potting compound is critical to ensuring the optimum performance of a LED driver power supply.  Selection of a particular potting compound depends on several factors such as:

  • Thermal performance, i.e. thermal conductivity
  • RF Performance, i.e. dielectric constant (indicates how much the EMC will be affected)
  • Chemical composition of the compound, i.e. if it is suitable for surface mounted components.
  • Time taken for partial and full cure

Click here to read full whitepaper.
Whitepaper: Case Temperature vs. Ambient Temperature
LXC100 Electronic components used in power supplies and other devices can be exposed to temperature extremes
that can damage them or shorten their life or MTBF (Mean Time Between Failure). It is very important to avoid
such potentially dangerous thermal conditions before they can damage the component. 

By measuring a base temperature (such as ambient or case temperature), component temperature can be modeled and this can then be used to avoid harmful thermal conditions. 

Click here to read the full whitepaper

White Paper: What to expect from your LED driver in the future

LED's are taking significant traction in the lighting market due to their lifetime, low cost of running, and the ability to control them for specific requirements. However, in order to achieve all of these things you need to ensure that your power supply driving these LED's is correctly specified in order to obtain the required performance. 


This paper will describe the design brief, projected performance parameters of the product, standards to be complied to and operational features to be met. It will also discuss trends in power supplies and what the customer can expect to see in the future from their power supplies.


Light Emitting Diodes: What you need to know about driving High Brightness LED's
This presentation looks at the challenges facing a luminaire design team as they go through the specification and design stages of a light fixture. It will also discuss future trends and what to expect from LED drivers in the future.

Click here to view full presentation.     
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