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INITIATING: Wafer Polishing Technologies & Markets - 2012 - 2017
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Linx has initiated a new report examining the use of CMP technology in prime wafer production. The need for advanced and accurate CMP is clearly illustrated in the graphic below, which illustrates the 3D global shape images of typical wafers manufactured by different suppliers.
Going forward, there will be heightened challenges for production wafers as we see the further introduction of SOI and perhaps III-V on Silicon. Wafer Polishing Technologies & Markets is scheduled for completion by the end of this year.
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| INITIATING: Material & Equipment Challenges for 450mm Wafer Processing |
As traditional lithography based scaling has ended, many new materials and processes have been implemented to keep the industry moving in accordance with Moore's Law. While this tactic has effectively maintained the enhancements required in device performance metrics, it has also led to a cost penalty on a $/cm2 basis.
Many IDMs are looking to 450mm wafer processing in an effort to realign their costs with business model expectations. However, key challenges exist in lithography, CMP, thermal processing, wet etch & clean, ALD/CVD/PVD, and etch that need to be resolved before 450mm can be implemented as illustrated below:
In Material & Equipment Challenges for 450mm Wafer Processing, Linx will address these issues and the impact of 450mm on the materials market.
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| Linx Presentations from Semicon West |
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The Development of the Semiconductor CVD and ALD Requirement
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Mike Corbett, Managing Partner, Linx Consulting
CMP Users Group
Semicon West, San Francisco, CA
July 11, 2012
Download a pdf of the presentation.
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| Linx Reports Update |
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Other Linx Reports:
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For more information or to order these reports, call Mike Corbett at 973.698.2331 or send us an email.
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