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Linx Presentation at Semi ISS
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Linx Presents 450mm Wafer Ramp and Illustrates Growing Importance of Advanced Materials in Semiconductors
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Linx Consulting presented at the Industry Strategy Symposium in January this year in Half Moon Bay, CA. Two of the major points made were:
- Ramp of 450 is inevitable and economically justified
- Semi process materials will be more important in the coming decade
Download the ISS presentation.
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Upcoming Report: Advanced Cleaning and Surface Preparation
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Cleaning is the most common operation in IC manufacturing, but the challenges in preparing the wafer surface for the next process step continue to increase as contamination must be eliminated, material removal limits reduce, and 3 dimensional fine features become more common.
Linx will be examining the trends in CSP through 2016 in |
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| COMING SOON: Emerging Materials for TSV devices |
Emerging materials for TSV Devices is almost complete. Among all different types of
packaging technologies proposed, three dimensional (3D) vertical integration using
through silicon via (TSV) copper interconnect is currently considered one of the most advanced technologies in the semiconductor industry. Through-silicon via (TSV) is the latest in a progression of technologies for stacking silicon devicein three dimensions (3D)
In Emerging materials for TSV Devices, Linx will:
- Review anticipated materials needs for potential future devices
- Discuss the relative challenges of competing TSV technologies
- Target markets for TSV materials
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