May 2009 Vol. 2, Iss. 19	www.solder.net
TABLE OF CONTENTS New Leadless Device Rework Process Solder Rinsing Process The Blender Defender QUICK LINKS Laser Services USB Device Recovery Training and Certifcation Reduce Your Rework Costs BEST can take a bite out of your rework costs. Call (847) 797-9250 and ask Laura how we may be able to help! Spaces Still Available for Soldering 101 Are you or someone you know in need of learning the very basics of soldering without any prior experience? Then sign up for the BEST Soldering 101 Class on May 14/15. There are a few seats left and it is only $495.00 . Call Christine at (847) 797-9250 to sign up today! BEST INDUSTRY FORUMS This Industry forum is a discussion area where opinions are given on equipment and processes, help is given on process problems and resources for problem-solving and troubleshooting are shared. ONLINE IPCA610 RECERTIFICATION Looking for a way to be cost-effectively re-certify as a trainer or operator for IPC A610? The BEST has a solution in its online recertification option. Call for details.	Dear Subscriber; Along with a video which shows exactly how to more easily reball ceramic package BGAs, this month's newsletter  features articles on : Laser machining of flex circuits-this will help you solve various flex modifications and rework required How to make a potato gun-this will give you some ideas for summer fun If you want to get a new hire "up to speed" with respect to hand soldering there are still a few seats left open for the May 14th and 15th Soldering 101 class. Students walk away with a basic of hand soldering, compo.nant identification, ESD, parts handling, and mixed technology hand soldering and inspection. Each student leaves the classroom with a working device to show their employer, children, spouses and co-workers. Best Wishes, Bob Wettermann President, BEST Inc Ceramic Reballing Simplified BEST has developed and perfected a new, simplified method for reballing ceramic BGAs. Unlike its plastic component counterpart which uses flux as the only medium to assist in the attachment of the new solder balls to the package, solder paste is used to attach the solder balls to the ceramic package.  The  solder paste is printed onto the bottom land patterns of the device. The difficulty is the balls must be in perfect alignment with the deposited paste and they must be deposited such that the paste is NOT smeared. BEST has developed a technique for simplifying this process. A StencilQuik(TM) is used to print the solder paste onto the part using a 1:1 aperture ratio. After the Stencilquik(TM) is released the balls are placed onto the device using an EZReball(TM) preform. See a video on this process here. Flex Circuit Laser Machining                          Looking for a competant partner for cutting, drilling or selectively removing material from your flex circuits? HDI flex cutting, hole and via drilling, selective polyimide removal is defined as laser processing on flex circuits with spaces and traces in the less than 200um ranges and 250um or less for vias. This density of flex circuits are used primarily in telecom, computer, IC manufacturing and medical devices. The BEST laser is tuned to be the most efficient cut on polyimide for flex processing. Less debris and better quality of cut compared with non polyimide-tuned lasers is the prduct of these lasers. See more informationhere. How to Make a Spud Gun Looking to have fun this summer in an open field, up at the lake house or with some friends out in the woods? See the direction at the llink below in order to see how to make a DIY spud gun from some simple supplied from Walmart and Home Depot. All the details here

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