The Nanowire November 2008

Upcoming CNS Events
Friday 11/21/08 9:30 am
Compound and Stereo Microscope Workshop
Registered CNS Users can attend a very useful training session on essential microscopy methods.  The location of this lecture is the Geological Lecture Hall 100 in the Natural History building (enter door closest to Hoffman Labs).  Pre-registration is required.

Contact Ellen Hodges: [email protected]
Wednesday 12/10/08 4:30 pm to 6:00 pm
CNS Open House / Poster Fest
LISE Ground Floor
Meet other CNS users, and present and view posters of research in a fun informal setting.
Other Upcoming Events
Friday Nov 21, 2008 4:00p - 5:00p
SEAS Applied Physics Colloquium: Oskar Painter, Caltech
Pierce 209
"Nano-optic-mechanics: Utilizing Light Forces within Guided-wave Nanostructures"
News
 
New Film Capabilities added to Harvard ALD

The CNS Savannah Atomic Layer Deposition system is now capable of depositing thin 100% conformal layers of the following materials, with single monolayer thickness control:  Al2O3, HfO2, SiO2, Pt, and the following will soon be available:  copper, cobalt, titanium strontium (titanate). Up to 8" wafers can be deposited, with roughly 0.5% uniformity
 
Contact Malcolm Hathaway [email protected] for further information.

 
New Bio-Imaging Scientist

Evangelos Gatzogiannis joins us as our new bio-imaging scientist, and brings with him significant laboratory experience.  He has a degree in Chemistry from the University of Pennsylvania, and a Masters degree in Physical Chemistry from Princeton.  He will also be our lead for biological imaging on the TIRF, our cell culture microscope, and the Bio-Materials facility. 

 
Photosynthesis Workshop was Huge Success
The National Nanotechnology Infrastructure Network Computation project (NNIN/C), in conjunction with the Harvard University Center for Nanoscale Systems (CNS), recently held a one day workshop entitled: " Photosynthesis - from Elementary Processes to Quantum Simulation." The event was held at Harvard University on October 10, 2008 and included participants from Harvard, MIT, University of Georgia, University of Michigan and the Riken Institute in Japan. The focus of the workshop was on the transport of electron-hole pairs through chlorophyll and the separation of the charges in the photosynthetic reaction center. The workshop emphasized computation but additionally included experimental perspectives from plant biologist Noel Michele Holbrook of Harvard University. The event was attended by approximately thirty-five participants.
 
New Equipment Engineer - Steve Paolini
Steve joins the Nanofab group with over 20 years of experience - most recently from the Route 128 Skyworks facility - with semiconductor process and cleanroom equipment.
 
Hundreds Attend CNS End of Summer Picnic
The sun shown brightly during the CNS outdoor picnic held August 22.  The event was attended by over 200 researchers and staff members, and included live music, BBQ lunch, and lawn games.  Look for a similar event in the LISE courtyard next spring.
In This Issue
New Film Capabilities
New Bio-Imaging Scientist
Steve Paolini
Nagoya University
Zeiss NVision 40 FIB Systems
New Flip Chip Bonder
Quick Links
Summer Student Brings Harvard Enthusiasm to Nagoya University
When CNS visiting summer student Takao Yasui returned this fall to Nagoya University, he outfitted his Chemistry Department Soccer team with new Crimson uniforms.  We wish that group the best of luck both on the field and in the lab!
 
 
Zeiss NVision 40 FIB Systems with Omniprobe Micromanipulator
Each of our FIB system is now equipped with an Omniprobe AutoProbe™ 300 nanomanipulator subsystem. This nanomanipulator system is a multi-purpose nano-positioning system capable of in-situ lift-out of transmission electron microscopy specimens, moving objects (nanowires, beads, etc) within the FIB, and making electrical contacts on a sample surface. The probe has a 100 nm resolution, with movements of about 30 nm. The probe tip retrieval system allows the user to obtain a new probe needle without having to break system vacuum, which greatly facilitates the use of the system.
 
Contact Fettah Kosar [email protected] for further information.
 
New Flip Chip Bonder
We've recently installed a Finetech Fineplacer Lambda Manual Sub-Micron Flip-Chip Bonder which provides accurate alignment and placement of a device chip to a substrate as an advanced form of chip interconnection.  During the bonding process, both chip and substrate are typically heated to an alloying temperature of the interconnect material. Also available is a heated pick and place tool which allows for heating the device chip in a full thermocompression bonding process.
Contact Noah Clay [email protected] for more information.