LPD-LPW banner 
Mentor ad
Power Management in USB 3.0

John DonovanUSB has become the most successful PC peripheral interconnect ever defined, with over 10 billion USB 2.0 products installed today. Still, despite its convenience, USB has never been either the fastest or the lowest-power interconnect protocol out there. USB 3.0 seriously attempts to address both of those problems. USB 3.0 promises a "SuperSpeed" data rate of 5Gb/sec, a 10x improvement over USB 2.0 while at the same time reducing power consumption. How can they do that you ask? More

Xilinx Zynq EPPs create a new category that fits in among SoCs, FPGAs, and microcontrollers

Steve Leibson

After telegraphing its punch at ESC last spring, Xilinx has now introduced the first four members of its EPP product line and named them Zynq to differentiate them from the company's FPGAs. Two of the four Zynq family members are designed for low-power applications and the other two emphasize performance over power. "What's an EPP?" you might ask. It's an "Extensible Processing Platform," a new IC category Xilinx hopes to create. Think of an EPP as an embedded processor with an attached FPGA fabric. More
How to add color to electronic ink
Robert Cravotta

Over the past few years, electronic ink has been showing up in an increasing number of end-user products. Approximately ten years ago, there were a couple of competing approaches to implementing electronic ink, but E-Ink's approach has found the most visible success of moving from the lab and viably existing in production level products, such as e-readers, indicators for USB sticks or batteries, as well as watch, smart card, and retail signage displays. More

February Wireless Update: Tensilica Claims #1 LTE IP Spot
Will StraussWith the scramble to get chips into the LTE (a.k.a. 4G) market, most cellular baseband chip companies are licensing their DSP cores from one of two major suppliers: CEVA, Inc. and Tensilica, Inc. CEVA clearly has a significant IP market lead in 2G and 3G shipments, worldwide, claiming its IP in 36% of worldwide cellular baseband shipments in the third quarter of 2010.  However, both companies are fighting for LTE design-ins. Tensilica claims to have the #1 position in LTE design-ins for cellular. More
ISQED ad
Industry News

ON Semiconductor Completes Acquisition of CMOS Image Sensor Business Unit from Cypress
 
ON Semiconductor has completed its acquisition of the CMOS Image Sensor Business Unit (ISBU) from Cypress Semiconductor in an all cash transaction for approximately $31.4 million, subject to adjustment under the purchase agreement.

 
Imec reports reconfigurable radio solutions enabling low-power spectrum sensing and low cost
 
Imec presents a digital front-end component for low-cost and low-power spectrum sensing, paving the way to power-efficient cognitive radios and networks. The new results support industry's search for increased flexibility and reliability for their next-generation wireless devices.

 
Skyworks Powering Multiple LTE Platforms
Skyworks Solutions, Inc. today announced that its extensive LTE product portfolio continues to gain traction with leading handset OEMs and smart phone providers and is at the heart of several new, yet unreleased 4G devices slated for launch later this year.

 
MediaTek Adopts Mentor Graphics Calibre PERC as its ESD and Circuit Reliability Verification Solution
 
Mentor Graphics Corporation today announced that MediaTek, Inc. has adopted the CalibreR PERC product as its solution for electrical rule checking (ERC) to help ensure comprehensive electrostatic discharge (ESD) protection and increase overall product reliability.

 
First Android operating system port available as open source code
 
Power.org, the open collaborative organization that enables, develops and promotes Power Architecture technology, announces the first Android operating system (OS) port available as open source code for the embedded community.

 
VIA Technologies Adopts Mentor Graphics Calibre PERC for Critical ESD Checking
Mentor Graphics Corporation today announced that VIA Technologies, Inc. is adopting the CalibreR PERC electrical rule checking product to ensure that electrostatic discharge (ESD) protection meets established guidelines to help prevent circuit failures and design re-spins.

 
Accellera Approves New Version of Electronic Design System Modeling Standard
Accellera announced today that its Board of Directors approved a new version of Accellera's Standard Co-Emulation Modeling Interface (SCE-MI) specification as a new Accellera verification standard. Version 2.1 speeds up electronic design verification since it allows a model developed for simulation to run in an emulation environment and vice versa.

Product News

Microchip Expands CAN Microcontroller Line With 5.5V Devices 
 
Microchip Technology Inc. today announced the PIC18F "K80" 8-bit CAN microcontrollers (MCUs) featuring 1.8 - 5.5V operation and eXtreme Low Power (XLP) technology, for the industry's lowest sleep current consumption of less than 20 nA.

 
IMST GmbH and Silicon Labs join forces to introduce Wireless M-Bus module for smart metering
 
Silicon Laboratories Inc. and IMST GmbH today introduced a turnkey wireless M-Bus solution designed for the smart energy market.

 
Cadence Opens and Extends Verification IP Catalog for Use Across Silicon, SoC and System Development
 
Cadence Design Systems, Inc. today detailed the extensive expansion of its broad portfolio of verification IP (VIP) and memory models, which delivers a robust verification solution spanning silicon, SoC and system development.

 
Imec and Renesas Electronics Announce Development of an Innovative SAW-Less Reconfigurable Transceiver
 
At this week's International Solid-State Circuit Conference, imec and Renesas Electronics Corporation present a highly-linear reconfigurable transceiver, eliminating the need of surface acoustic wave (SAW) filters.

 
National Semiconductor Introduces Industry's Highest-Efficiency, High-Current Buck Regulators
 
National Semiconductor Corp. today introduced a pair of high-current, synchronous buck regulators with the industry's highest efficiency at 97 percent.

 
TI power development kits for precision analog get the noise out
 
Texas Instruments Incorporated (TI) introduced two power management development kits, which help designers generate the cleanest possible positive and negative voltage rails to power today's analog circuits.

 
RFMD Unveils Portfolio Of Cellular Front End Modules For 3G/4G Switch And Signal Conditioning Applications
 
RF Micro Devices, Inc. today announced the addition of four new products to RFMD's expanding portfolio of front end modules for 3G/4G switch and signal conditioning applications.

 
STMicroelectronics Unveils Solution for Modular Smart Meters
 
As installations of smart meters in homes and businesses accelerate globally, STMicroelectronics has unveiled a new set of metering chips that offer the industry's most accurate and cost-effective solution for next-generation smart meters.

 
TI introduces two PRU daughter cards for the AM1x Sitara ARM9 MPUs
 
Texas Instruments Incorporated (TI) introduces two new programmable real-time unit (PRU) daughter cards and free software that allow customers to add differentiated peripherals and design flexibility for reduced development coststo extend the functionality of their AM1x Sitara ARM microprocessor-based systems.

 
Step-Down Converter with Linear Bypass Powers Multimode PAs in Mobile Handsets
 
Maxim Integrated Products introduces the MAX8989, a step-down converter designed to power PA (power amplifier) modules in mobile phones.

 
IAR Systems launches complete development kit for Freescale Kinetis K60 family of MCUs and modular Tower System
 
IAR Systems today announced availability of a new IAR KickStart Kit for Freescale Semiconductor's ARM Cortex-M4 based Kinetis family of microcontrollers that is compatible with the Freescale Tower System development platform.

 

Training Courses

computerFundamentals of Solar: Grid Connected

Photovoltaic (PV) solar technology is at the heart of the multi-billion dollar clean/green/renewable energy industry, powering everything from road signs to entire cities. This course covers the fundamentals of grid-connected PV systems, with the aim of providing engineers with a good overview of the technologies, topologies and electronics that make up such systems.

 

computerFundamentals of Microcontrollers

EE Times Fundamentals course provides an introduction to microcontrollers (MCUs) including usage and selection of the devices. The course also includes a video explaining showing how to get started with an mbed evaluation kit.

John Donovan
Editor/Publisher, Low-Power Design & Low-Power Wireless