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Industry News
Active Implants
Medical Devices containing electronic components, which are implanted in the body either permanently or temporarily are called Active Implants.
The first clinical implantation into a human of an Active Implant was that of an implantable pacemaker in 1958 at the Karolinska Institute in Solna, Sweden, by Rune Elmqvist and surgeon Åke Senning.
The cardiac pacemaker became a major medical device with a current market size of almost $4B. It became the model for the development of implantable neurostimulators. such as Deep-Brain-Stimulators in the late 1990's.
A second family of Active Implants, the Sensorial Prosthesis, were derived from the classical hearing aid that was migrating under the skin to become a cochlear implant. The first developments started as early as 1957 when Djourno and Eyriès implanted the first single channel device with a transcutaneous link and in 1961 when William House implanted the first device. This development subsequently opened the possibility of the development of the first Retinal Implants.
A third branch was the implantable infusion pump technology which started with Christopher Dyer Saudek,at the Johns Hopkins Comprehensive Diabetes Center. From this approach impla ntable infusion pumps for pain and cancer treatment were derived.
In the last few years several new applications have emerged for implantable electronics such as electronic Gastric Bands, EEG Monitors to detect hypoglycemia and artificial urinary sphincters.

The Active Implants market represents a B$40.0 market which has been growing seven to ten percent annually since 2007. Safety and efficacy of active implants have continued to improve and the bubble of aging baby boomers entering their senior years has stimulated growth. Market growth can be expected despite the drive to reduce health care costs.
Valtronic's experience in the Active Implant market is extensive.Worldwide Valtronic has 17 Active Implant programs running which is a large share of the market amongst Contract Manufacturers. Valtronic combines exceptionally high quality, creative design solutions and the ability to provide customers a design which optimizes manufacturability and scalability.
Valtronic's manufacturing technologies are particularly attractive for the miniaturized electronics used in Active Implants. Our wire bonding and an extensive experience with 3D chip scale packages, along with our ISO 13485 and FDA experience and a long term presence in the orthopedic implant sector are important assets for competing in this market.

Examples of Active Implants that Valtronic supplies to its OEM customers are cochlear implants and their external sound processing units, pulse generators that mitigate pain, devices to control obesity or smart pills which are swallowed by a patient collecting and transmitting data as they pass through the digestive track. We offer engineering consulting, development and production of advanced assemblies for the electronic control boards inside such systems. For more information contact:
Switzerland: Frederic Mauron: fmauron@valtronic.com
USA: Jim Ohneck: johneck@valtronic.com
For a more detailed look at trends of electronics in implants, Roundtable: Medical Electronics and Power Components Get Smart, Stay Small
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Behind the Scenes
Valtronic Welcomes Lamia Harrak, Quality Manager Morocco

What is the most important part of your job?
The most important part of my job is making sure customers are completely satisfied. My goal is to create an experience where our customer is not only loyal but encourages others to work with Valtronic as well.
What is a typical day like for you?
A typical doesn't exist for me. I focus is on learning new things each day and observing circumstances in different ways. Every day is a new challenge and with new challenges I must be open to ideas and learn to address anything that comes my way.
How did you get into quality management?
I have always had an interest in this area. I earned my Masters in Quality Security Environments. I then gained 5 years' experience in quality security management as a quality manager for a French multinational doing electrical, mechanical and climatic engineering.
What is the most important lesson you have learned in your career?
There are actually two very important lessons I have learned. I learned early on to face fears as they can hold us back. I do not say we cannot do something. My goal is to figure out a way that a challenge can be met.
The second lesson is to treat people like you want to be treated. If you do this you will get their best effort. People will feel comfortable communicating and any issues that do arise will be more easily solved.
Lastly, what do you look forward to doing that is not work related?
The activity I enjoy must is organizing and volunteering. In the end I just like to help people.
Switzerland
Jean-Vincent Le Bé has been promoted to Assistant Vice President Engineering and Technology and will lead the Engineering Department. He joins the Group Management Board.
North America
Jim Ohneck has been promoted to Vice President Marketing and Sales for Valtronic Technologies (USA) Inc.
Patricia Klavora has joined the Valtronic team as Marketing Communications Manager worldwide.
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Tech Talk
Low Profile Chip on Board
Implantable electronics require continuous advancement and adaptations in miniaturization. Chip-on-board (COB) assembly was an important step to miniaturization as it enables direct chip assembly on the same substrate as passive components. To achieve this, aluminum wire bonding was required in order to be compatible with the standard PCB metallization finish for Sn soldering. Evolution in plating processes allow for the use of gold with COB assembly on the same substrate as standard Tin soldering. This offers a great advantage in further miniaturizing an assembly. Since gold is much softer than aluminum, the design of worked loops became possible and very low profiles could be achieved (see figure). 
On top of this, over moulding provides for a very accurate and repeatable encapsulation process (see picture) achieving an assembly where the distance between the chip and the outer-border of the encapsulation is 500μm both horizontally and vertically (using 250μm thick chips). With the advances of the low profile gold wire bonding and the overmoulding, the COB takes only half the real estate than when originally developed.
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Conference & Events
MD&M West February 2011
Please visit us at the MD&M West show in Anahiem, CA Februrary 8-10, 2011. We will be on the main exhibit floor in booth 1992. For a complimentary expo pass register online using Promo Code: BZ.
MEDTECH Europe - March '11
Please visit us at the MedTech Europe in Stuttgart Germany March 22-24, 2011. Visit us in booth 2416. For a complimentary expo pass register online using Promo Code:
We look forward to seeing you!
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Thank you to all who visited us at the MD&M Minneapolis, Medica and IMAPS events. We are excited to see the products and technologies being developed by our customers and partners and look forward to working with you to bring them to market.
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Partners News
Valtronic and the Ohio Aerospace Institute (OAI) Partner to Advance Innovations in Aerospace Electronics
Valtronic Technologies (USA), Inc. has partnered with the Ohio Aerospace Institute (OAI) to provide solutions in sensors and electronic miniaturization technologies for aerospace companies in Ohio and throughout the U.S.
The Valtronic and OAI partnership is working to gather experts in aerospace to deliver new services in research & technology and design & manufacturing. Valtronic and OAI have approached NASA, the Air Force, Navy, Army and other customers to discuss the benefits of Valtronic's innovative technologies.
OAI and Valtronic are exploring the benefits to Ohio of the Air Force Base Realignment and Closure (BRAC) process. BRAC makes Wright Patterson Air Force Base (WPAFB) the center of the 711th Human Performance Wing and offers opportunities for Valtronic to serve the Wing's needs in adapting electronic technologies to improve human performance.
Ohio is a leading aerospace state with an extensive integrated aerospace supply chain. Major Ohio aerospace companies include: GE Aviation, Goodrich Corporation, Parker Hannifin, Meggitt Aircraft Braking Systems, The Boeing Company, Northrop Grumman, Alcoa Forged Products, RTI International Metals Inc., GrafTech International Ltd., Honeywell International Inc., The Timken Company, ATK and over 600 others.
In May 2010 Valtronic and OAI hosted a Roundtable event at Valtronic's Solon facility providing OAI industry members with a tour and presentation on Valtronic's capabilities for the aerospace industry.
For additional information on the new Valtronic-OAI Alliance, please contact Don Styblo at Valtronic Technologies at dstyblo@valtronictechnologies.com.
For additional information on OAI, please contact Donald Majcher at donaldmajcher@oai.org or visit www.oai.org.
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Moroccoan Foundation for Advanced Science, Innovation and Research
Valtronic (Morocco) has partnered with the Moroccan Foundation for Advanced Science, Innovation and Research (MAScIR) to collaborate on new project.
MAScIR was created in 2007, and thanks to the support of the Moroccan government and the foundation's members, the teams working at the MAScIR have been working to install a world class infrastructure to develop state of the art technology platforms in order to conduct research in the broad fields of environment, water, energy and health & life sciences.
Within its microelectronics platform, MAScIR aims at developing world class technical & entrepreneurial talents in the broad field of microelectronics including Software & Hardware, IC Packaging (design, simulation, assembly process development and qualification) and high Q&R low volume manufacturing.
The Microelectronic program has assembled a world class management team to provide initial traction, and licensed cutting edge technologies which are available for immediate use.
We look forward to working with MAScIR to advance electronic technologies and to accelerating their adaptation.
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Stay Tuned
Our new website will launch in late January. It will include updates on our capabilities and showcase projects to provide you with an example of how we apply our technology to your products. |
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