Greetings!
You are invited to attend our informative and interactive Lead-Free Webinar featuring Dr. Jennie Hwang - right from your computer! This 10-part series will answer your questions and alleviate your fears concerning Lead-Free Manufacturing Defects and Remedies. The webinar is divided into ten 60 minute sessions with the following schedule: Session 1: Tin Whisker and Tin Pest Thursday May 14, 11:00 AM EDT
Session 2: Solder Joint Voids Thursday May 21, 11:00 AM EDT
Session 3: Tomb-Stoning Thursday May 28, 11:00 AM EDT
Session 4: Solderability and Wetting Thursday June 18, 11:00 AM EDT
Session 5: Component-Related Defects/Issues Thursday July 9, 11:00 AM EDT
Session 6: BGA/CSP Rework Thursday July 16, 11:00 AM EDT
Session 7: PCB Surface Finish Types Thursday July 23, 11:00 AM EDT
Session 8: PCB Blackpad Issue Thursday July 30, 11:00 AM EDT
Session 9: PCB Board-Level Issues/Remedies Thursday August 6, 11:00 AM EDT
Session 10: Solder Joint Fillet Acceptance Thursday August 13, 11:00 AM EDT
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