|
APC International Products & Services
Do you need to save time, money or reallocate people?
APC International both stocks standard piezo products and manufactures customer piezo parts. In addition, in house assembly and contract manufacturing services can reduce costs and improve the allocation of key personnel. APC International's skilled engineering staff and in-house research facilities enable us to offer a range of piezo design and consulting services to save you time, effort, and expense including: materials development, transducer design, systems optimization, and custom joint development programs. Custom Piezo Elements Standard Products In-house Assembly & Contract Manufacturing Product Design & Consulting Services
REQUEST A QUOTE |  |
| | |  | |
|
| |
|
40th Annual Ultrasonic Industry Association Symposium
When: May 23-25, 2011
Where: Wolfson Medical School
University of Glasgow
Glasgow, Scotland UK
Event Info: This workshop provides a forum for the discussion of state-of-the-art materials and devices to generate, detect and suppress sound. Papers will be presented and commercial firms may also display and/or present products. Review additional event information here! Check out links to prior UIA Symposia Proceedings
|
|  | |
|  | |
|
15th Annual US-Japan Seminar on Dielectric and Piezoelectric Ceramics
When: November 6-11, 2011
Where: Shiroyama Kanko Hotel
Kagoshima, Japan
Event Info: This is a highly interactive workshop with robust participation from industry. Papers will be solicited in the following areas:
- Basic Science of Dielectric and Piezoelectric Materials
- Dielectric Capacitor Materials and MLCC Technology
- Piezoelectric Materials, Phenomena and Applications
- Microelectromechanical and Nonlinear Dielectric Systems
- Electronic Materials in Energy; Conversion, Harvesting, Photovoltaic, and Photoelectrochemical effects
- Polar semiconductors and interfacial nanoelectronics in oxides and nitrides
- Local Behavior in Ferroelectrics
- Thin Films: Material Science, Applications
More information will follow shortly regarding abstract submission and additional meeting information.
| |  | |
| | |
